TT320N18SOFHPSA1

分立半导体模块 THYR / DIODE MODULE DK

Summary of Features:

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Solder-Bond Technology

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Industrial standard package

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Electrically insulated copper base plate

Benefits:

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Cost effective solution for higher competitiveness

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Predictably high performance and lifetime due to 100% x-ray monitoring

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Solid base plate for fast and easy mounting

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One-stop-shop due to complete module technology portfolio