TSM4YL104KB25

4mm 11 转密封 250mW TSM 4YL 系列小尺寸，具备最佳封装密度 专业等级 低接触电阻变化，稳定性出色 适用于手动和自动操作 完全密封，符合 IP67 汽相和回流焊接 在印迹剖面中提供Resistive Element | Cermet ---|--- Power Rating | 250mW at 85°C Limiting Element Voltage | 200V linear law Tolerance Standard | ±10% Temperature Coefficient | ±100ppm/°C Contact Resistance Variation | 1% or 3 ohms Electrical Travel | 11 turns ±2 Operating Torque | 1 Ncm max. Rotational Life Electrical & Mechanical | 100 cycles - rated power Soldering Temperature | Vapour phase 215°C/20 secs. Reflow: 230°C/20 secs.Do not exceed peak 260°C   |     |   Operating Temperature Range | -55°C to +125°C Dimensions | W. 5.0 D.5.0 H. 3.7mm ### 多转贴片电容器

4mm 11 转密封 250mW TSM 4YL 系列

小尺寸，具备最佳封装密度

专业等级

低接触变化，稳定性出色

适用于手动和自动操作

完全密封，符合 IP67

汽相和回流焊接

在印迹剖面中提供

Resistive Element | Cermet

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Power Rating | 250mW at 85°C

Limiting Element Voltage | 200V linear law

Tolerance Standard | ±10%

Temperature Coefficient | ±100ppm/°C

Contact Resistance Variation | 1% or 3 ohms

Electrical Travel | 11 turns ±2

Operating Torque | 1 Ncm max.

Rotational Life Electrical & Mechanical | 100 cycles - rated power

Soldering Temperature | Vapour phase 215°C/20 secs. Reflow: 230°C/20 secs.Do not exceed peak 260°C

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Operating Temperature Range | -55°C to +125°C

Dimensions | W. 5.0 D.5.0 H. 3.7mm