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SPC5533MVM80R

SPC5533MVM80R

数据手册.pdf
NXP 恩智浦 电子元器件分类

NXP 32Bit MCU, Power Arch, 768KB Flash, 80MHz, -40/+125℃, Automotive Grade, MAPBGA 208

Overview

The ® MPC5534 MCU provides an ultra-low cost solution for low-end engine management applications.

* Supports applications requiring complex, real-time control

* Offers system performance along with the reliability and familiarity of the proven Power Architecture®

* Controls design costs for increasingly complex applications

* Includes a peripheral set specifically tailored for automotive and industrial applications

* Delivers more on-chip functionality than the current MPC500 family

* Offers a migration path from the MPC500 family, facilitating reuse of legacy software architectures

MoreLess

## Features

### Our e200z3 Core + VLE

* High-performance 80 MHz 32-bit Power Architecture core with VLE

* Memory management unit MMU with 16-entry fully associative translation lookaside buffer TLB

* SPE signal processing extension: DSP, SIMD and floating point capabilities

### Memory

* 1 MB of embedded flash memory with error correction coding ECC and read while write capability RWW

* 64 KB on-chip static RAM with ECC system

### System

* One enhanced time processor units eTPUs with 32 I/O channels and 14.5k of designated SRAM

* 32-channel eDMA enhanced direct memory access controller

* Interrupt controller INTC capable of handling 210 selectable-priority interrupt sources

* Frequency modulated phase-locked loop FMPLL to assist in electromagnetic interference EMI management

* MPC500 compatible external bus Interface

* Nexus IEEE®-ISTO 5001 class 3+ multicore debug capabilities

* 5/3.3V IO, 5V ADC, 3.3V/1.8V bus, 1.5V core

* 208-pin MAPBGA and 324-pin PBGA package options

* Temperature Range: -40 to 125ºC

### I/O

* 40 channel dual enhanced queued analog-to-digital converter eQADC—up to 12 bit resolution and up to 1.25ms conversions, six queues with triggering and DMA support

* Three deserial serial peripheral interface DSPI modules-16 bits wide up to six chip selects each

* Two controller area network CAN modules with 64 buffers each

* Two enhanced serial communication interface eSCI modules

* 24-channel enhanced multiple I/O system EMIOS with unified channels

### Development Tools

* A comprehensive suite of hardware and software development tools is available to help simplify and speed system design

* Development support is available from leading tools vendors providing compilers, debuggers and simulation development environments

### Included in NXP ®.s product longevity program

* Product longevity program with assured supply for a minimum of 15 years after launch

* Product longevity program with assured supply for a minimum of 15 years after launch

SPC5533MVM80R中文资料参数规格
封装参数

安装方式 Surface Mount

引脚数 208

封装 BGA-208

外形尺寸

封装 BGA-208

其他

产品生命周期 Not Recommended for New Designs

符合标准

RoHS标准 RoHS Compliant

含铅标准 Lead Free

SPC5533MVM80R引脚图与封装图
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