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SPC560P50L3CEFBY

SPC560P50L3CEFBY

数据手册.pdf

MCU 32Bit SPC560P50x e200z0 RISC 512KB Flash 3.3V 100Pin LQFP Tray

This 32-bit system-on-chip SoC automotive microcontroller family is the latest achievement in integrated automotive application controllers. It belongs to an expanding range of automotive-focused products designed to address chassis applications—specifically, electrical hydraulic power steering EHPS and electric power steering EPS—as well as airbag applications.

**Key Features**

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64 MHz, single issue, 32-bit CPU core complex e200z0h
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Compliant with Power Architecture® embedded category
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Variable Length Encoding VLE
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Memory organization
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Up to 512 KB on-chip code flash memory with ECC and erase/program controller
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Additional 64 4 × 16 KB on-chip data flash memory with ECC for EEPROM emulation
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Up to 40 KB on-chip SRAM with ECC
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Fail safe protection
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Programmable watchdog timer
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Non-maskable interrupt
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Fault collection unit
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Nexus L2+ interface
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Interrupts
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16-channel eDMA controller
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16 priority level controller
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General purpose I/Os individually programmable as input, output or special function
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2 general purpose eTimer units
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6 timers each with up/down count capabilities
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16-bit resolution, cascadable counters
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Quadrature decode with rotation direction flag
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Double buffer input capture and output compare
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Communications interfaces
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2 LINFlex channels LIN 2.1
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4 DSPI channels with automatic chip select generation
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1 FlexCAN interface 2.0B Active with 32 message objects
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1 safety port based on FlexCAN with 32 message objects and up to 7.5 Mbit/s capability; usable as second CAN when not used as safety port
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1 FlexRay™ module V2.1 with selectable dual or single channel support, 32 message objects and up to 10 Mbit/s 512 KB device only
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Two 10-bit analog-to-digital converters ADC
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2 × 11 input channels, + 4 shared channels
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Conversion time < 1 μs including sampling time at full precision
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Programmable ADC Cross Triggering Unit CTU
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4 analog watchdogs with interrupt capability
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On-chip CAN/UART bootstrap loader with Boot Assist Module BAM
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1 FlexPWM unit: 8 complementary or independent outputs with ADC synchronization signals
SPC560P50L3CEFBY中文资料参数规格
技术参数

RAM大小 40K x 8

工作温度Max 125 ℃

工作温度Min -40 ℃

封装参数

安装方式 Surface Mount

封装 LQFP-100

外形尺寸

封装 LQFP-100

物理参数

工作温度 -40℃ ~ 125℃ TA

其他

产品生命周期 Active

包装方式 Tray

符合标准

RoHS标准 RoHS Compliant

含铅标准 无铅

海关信息

ECCN代码 3A991A2

SPC560P50L3CEFBY引脚图与封装图
SPC560P50L3CEFBY电路图

SPC560P50L3CEFBY电路图

在线购买SPC560P50L3CEFBY
型号 制造商 描述 购买
SPC560P50L3CEFBY ST Microelectronics 意法半导体 MCU 32Bit SPC560P50x e200z0 RISC 512KB Flash 3.3V 100Pin LQFP Tray 搜索库存
替代型号SPC560P50L3CEFBY
图片 型号/品牌/封装 代替类型 描述 替代型号对比

型号: SPC560P50L3CEFBY

品牌: ST Microelectronics 意法半导体

封装: LQFP

当前型号

MCU 32Bit SPC560P50x e200z0 RISC 512KB Flash 3.3V 100Pin LQFP Tray

当前型号

型号: SPC5604PGF1MLL6

品牌: 恩智浦

封装: LQFP 64MHz 100Pin

功能相似

NXP  SPC5604PGF1MLL6  芯片, 微控制器, 32位, QORIVVA, 100LQFP

SPC560P50L3CEFBY和SPC5604PGF1MLL6的区别