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S29GL01GS11TFIV20

S29GL01GS11TFIV20

数据手册.pdf
Spansion 飞索半导体 电子元器件分类

NOR Flash Parallel 3V/3.3V 1Gbit 64M x 16Bit 110ns 56Pin TSOP Tray

GL-S MirrorBit® Eclipse™ Flash Non-Volatile Memory Family

S29GL01GS  1 Gbit  128 Mbyte

S29GL512S  512 Mbit  64 Mbyte

S29GL256S  256 Mbit  32 Mbyte

S29GL128S  128 Mbit  16 Mbyte

CMOS 3.0 Volt Core with Versatile I/O

General Description

The ® S29GL01G/512/256/128S are MirrorBit Eclipse flash products fabricated on 65 nm process technology. These devices offer a fast page access time as fast as 15 ns with a corresponding random access time asfast as 90 ns. They feature a Write Buffer that allows a maximum of 256 words/512 bytes to be programmed in one operation, resulting infaster effective

programming time than standard programming algorithms. Thismakes these devices ideal for today’s embedded applications that require higher density, better performance and lower power consumption.

Distinctive Characteristics

65 nm MirrorBit Eclipse Technology

Single supply VCC for read / program / erase 2.7V to 3.6V

Versatile I/O Feature

       – Wide I/O voltage range VIO: 1.65V to VCC

x16 data bus

Asynchronous 32-byte Page read

512-byte Programming Buffer

       – Programming in Page multiples, up to a maximum of 512 bytes

Single word and multiple program on same word options

Sector Erase

       – Uniform 128-kbyte sectors

Suspend and Resume commands for Program and Erase operations

Status Register, Data Polling, and Ready/Busy pin methods to determine device status

Advanced Sector Protection ASP

     – Volatile and non-volatile protection methods for each sector

Separate 1024-byte One Time Program OTP array with two lockable regions

Common Flash Interface CFI parameter table

Temperature Range

     – Industrial -40°C to +85°C

     – In-Cabin -40°C to +105°C

100,000 erase cycles for any sector typical

20-year data retention typical

Packaging Options

     – 56-pin TSOP

     – 64-ball LAA Fortified BGA, 13 mm x 11 mm

     – 64-ball LAE Fortified BGA, 9 mm x 9 mm

     – 56-ball VBU Fortified BGA, 9 mm x 7 mm

S29GL01GS11TFIV20中文资料参数规格
技术参数

电源电压 2.7V ~ 3.6V

封装参数

安装方式 Surface Mount

封装 TSOP-56

外形尺寸

封装 TSOP-56

其他

产品生命周期 Unknown

包装方式 Tray

符合标准

RoHS标准 RoHS Compliant

含铅标准 Lead Free

S29GL01GS11TFIV20引脚图与封装图
暂无图片
在线购买S29GL01GS11TFIV20
型号 制造商 描述 购买
S29GL01GS11TFIV20 Spansion 飞索半导体 NOR Flash Parallel 3V/3.3V 1Gbit 64M x 16Bit 110ns 56Pin TSOP Tray 搜索库存
替代型号S29GL01GS11TFIV20
图片 型号/品牌/封装 代替类型 描述 替代型号对比

型号: S29GL01GS11TFIV20

品牌: Spansion 飞索半导体

封装: 56-TFSOP

当前型号

NOR Flash Parallel 3V/3.3V 1Gbit 64M x 16Bit 110ns 56Pin TSOP Tray

当前型号

型号: S29GL01GS10TFI010

品牌: 飞索半导体

封装: TSOP 128000000B 2.7V 56Pin

完全替代

Spansion### 快闪存储器闪存 IC 是非易失 RAM,必须按块写入/擦除。 它有限定的写入周期的次数,适用于不经常更改的程序存储。

S29GL01GS11TFIV20和S29GL01GS10TFI010的区别

型号: S29GL01GS11TFI010

品牌: 飞索半导体

封装: TSOP 128000000B 2.7V 56Pin

完全替代

SPANSION  S29GL01GS11TFI010  闪存, 1 Gbit, 64M x 16位, 并行, TSOP, 56 引脚

S29GL01GS11TFIV20和S29GL01GS11TFI010的区别

型号: S29GL01GS11TFI020

品牌: 飞索半导体

封装: TSOP 128000000B 2.7V 56Pin

完全替代

NOR Flash Parallel 3V/3.3V 1Gbit 64M x 16Bit 110ns 56Pin TSOP Tray

S29GL01GS11TFIV20和S29GL01GS11TFI020的区别