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S29GL512S10DHI010

S29GL512S10DHI010

数据手册.pdf
Spansion 飞索半导体 主动器件

SPANSION  S29GL512S10DHI010  闪存, 或非, 512 Mbit, 32M x 16位, 并行, FBGA, 64 引脚

GL-S MirrorBit® Eclipse™ Flash Non-Volatile Memory Family

S29GL01GS  1 Gbit  128 Mbyte

S29GL512S  512 Mbit  64 Mbyte

S29GL256S  256 Mbit  32 Mbyte

S29GL128S  128 Mbit  16 Mbyte

CMOS 3.0 Volt Core with Versatile I/O

General Description

The ® S29GL01G/512/256/128S are MirrorBit Eclipse flash products fabricated on 65 nm process technology. These devices offer a fast page access time as fast as 15 ns with a corresponding random access time asfast as 90 ns. They feature a Write Buffer that allows a maximum of 256 words/512 bytes to be programmed in one operation, resulting infaster effective

programming time than standard programming algorithms. Thismakes these devices ideal for today’s embedded applications that require higher density, better performance and lower power consumption.

Distinctive Characteristics

65 nm MirrorBit Eclipse Technology

Single supply VCC for read / program / erase 2.7V to 3.6V

Versatile I/O Feature

       – Wide I/O voltage range VIO: 1.65V to VCC

x16 data bus

Asynchronous 32-byte Page read

512-byte Programming Buffer

       – Programming in Page multiples, up to a maximum of 512 bytes

Single word and multiple program on same word options

Sector Erase

       – Uniform 128-kbyte sectors

Suspend and Resume commands for Program and Erase operations

Status Register, Data Polling, and Ready/Busy pin methods to determine device status

Advanced Sector Protection ASP

     – Volatile and non-volatile protection methods for each sector

Separate 1024-byte One Time Program OTP array with two lockable regions

Common Flash Interface CFI parameter table

Temperature Range

     – Industrial -40°C to +85°C

     – In-Cabin -40°C to +105°C

100,000 erase cycles for any sector typical

20-year data retention typical

Packaging Options

     – 56-pin TSOP

     – 64-ball LAA Fortified BGA, 13 mm x 11 mm

     – 64-ball LAE Fortified BGA, 9 mm x 9 mm

     – 56-ball VBU Fortified BGA, 9 mm x 7 mm

S29GL512S10DHI010中文资料参数规格
技术参数

电源电压DC 2.70V min

供电电流 60 mA

针脚数 64

存取时间 100 ns

内存容量 64000000 B

存取时间Max 100 ns

工作温度Max 85 ℃

工作温度Min -40 ℃

电源电压Max 3.6 V

电源电压Min 2.7 V

封装参数

安装方式 Surface Mount

引脚数 64

封装 FBGA

外形尺寸

封装 FBGA

其他

产品生命周期 Active

包装方式 Tray

符合标准

RoHS标准 RoHS Compliant

含铅标准 Lead Free

REACH SVHC标准 No SVHC

REACH SVHC版本 2015/12/17

海关信息

香港进出口证 NLR

S29GL512S10DHI010引脚图与封装图
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在线购买S29GL512S10DHI010
型号 制造商 描述 购买
S29GL512S10DHI010 Spansion 飞索半导体 SPANSION  S29GL512S10DHI010  闪存, 或非, 512 Mbit, 32M x 16位, 并行, FBGA, 64 引脚 搜索库存
替代型号S29GL512S10DHI010
图片 型号/品牌/封装 代替类型 描述 替代型号对比

型号: S29GL512S10DHI010

品牌: Spansion 飞索半导体

封装: FBGA 64000000B 2.7V 64Pin

当前型号

SPANSION  S29GL512S10DHI010  闪存, 或非, 512 Mbit, 32M x 16位, 并行, FBGA, 64 引脚

当前型号

型号: S29GL512S10DHI020

品牌: 飞索半导体

封装: FBGA 64000000B 2.7V 64Pin

完全替代

NOR Flash Parallel 3V/3.3V 512Mbit 32M x 16Bit 100ns 64Pin FBGA Tray

S29GL512S10DHI010和S29GL512S10DHI020的区别