RE334-LF

Matrixboard with Ground Plane Hot air levelled Through holes have etched-free ring on ground plane side to provide isolated ground plane on component side Plated through holes for both DIN connector and PCB matrix RE334 only Ground plane designed to reduce EMI problems in high frequency circuits Connector type DIN 41612 C-96/abc Epoxy Glass Double sided Board size 100 x 160 x 1.5mm Hole pitch 2.54mm 0.1 in Hole dia 1.0mm Copper thickness 35μm DIN 类型矩阵板 矩阵板，带有 1 mm 的孔，节距为 2.54 mm。

The is a 100 x 160mm Eurocard dual inline Prototyping Board, made of 1.5mm fibreglass FR4 and 35µm Cu single-sided construction with component print and soldering stop mask surface. This hot air levelling prototyping board comes with 32/64/96-channel DIN 41612 type C connector. The component side is totally laminated by copper, no conducting connection to the component side by etched free holes. If the copper coating is grounded, the electrical components are optimally shielded against the solder side. This board used to built-up HF, digital and analogue circuits with high reliability.

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1mm Hole diameter

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2.54 x 2.54mm Hole spacing