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数据手册.pdfi.MX 6Dual Processors - Dual-Core, 3D Graphics, HD Video, Multimedia, ARM Cortex-A9 Core
Overview
The i.MX 6 series of applications processors combines scalable platforms with broad levels of integration and power-efficient processing capabilities particularly suited to multimedia applications. The i.MX 6Dual processor features:
* Enhanced capabilities of high-tier portable applications by fulfilling MIPS needs of operations systems and games
* Multilevel memory system
* Smart speed technology that enables the designer to deliver a feature-rich product, requiring levels of power far lower than industry expectations
* Dynamic voltage and frequency scaling
* Powerful graphics acceleration
* Interface flexibility
* Integrated power management throughout the device
* Advanced hardware-enabled security
The i.MX 6Dual is supported by a companion ® power management IC PMIC, MMPF0100.
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## Features
### CPU Complex
* 2x ARM® Cortex™-A9 up to 1.2 GHz
* 1 MB L2 cache
* 32 KB instruction and data caches
* NEON SIMD media accelerator
### Multimedia
* GPU 3D
* Vivante GC2000
* 200Mtri/s 1000Mpxl/s, OpenGL ES 3.0 & Halti, CL EP
* GPU 2DVector Graphics
* Vivante GC355
* 300Mpxl/s, OpenVG 1.1
* GPU 2DComposition
* Vivante GC320
* 600Mpxl/s, BLIT
* Video Decode
* 1080p 60 h.264
* Video Encode
* 1080p30 H.264 BP/ Dual 720p encode
* Camera Interface
* Types:1x 20-bit parallel, MIPI-CSI2 4 lanes, three simultaneous inputs
### Memory
* DDR
* 2x32 LP-DDR2, 1x64 DDR3 / LV-DDR3
* NAND
* SLC/MLC, 40-bit ECC, ONFI2.2, DDR
### Connectivity
* Four USB2.0
* 1xHS OTG + PHY
* 1xHost + PHY
* 2xHost USB HSIC
* Ethernet
* 1 Gbps + IEEE1588
* Expansion Ports
* 3x SD/MMC 4.4, 1x SDXC
* 5x SPI, 5x UART, 3x I²C
* MIPI-HSI
* PCIe 2.0 1 lane
### Display
* 2 x 4XGA 2048x1536 or 2 x [1080p + WXGA 1280x720]
* EPDC, LVDS, Parallel, MIPI-DSI
### Advanced Power Management
* PMU integration
* NXP® PF100 power management unit
### Security
Advanced security supporting:
* High Assurance Boot
* Cryptographic cipher engines
* Random number generator
* Tamper detection
### Package and Temperature
* 21 x 21mm, 0.8 mm BGA
* Consumer -20C to +105C, up to 1.2 GHz
* Industrial -40C to +105C, up to 800 MHz
* Automotive -40C to +125C, AEC-Q100, up to 1 GHz