MLG1608B4N7S

TDK  MLG1608B4N7S  表面贴装高频电感器, MLG系列, 4.7 nH, ± 0.3nH, 0603 [1608 公制], 5 GHz, 0.15 ohm

Inductor High Frequency Chip Unshielded Multi-Layer 4.7nH 0.3nH 100MHz 10Q-Factor Ceramic 600mA 150mOhm DCR 0603 T/R

e络盟:
高频电感器, 4.7 nH, MLG系列, 600 mA, 0603 [1608 公制], 多层, 0.15 ohm

艾睿:
Inductor High Frequency Chip Unshielded Multi-Layer 4.7nH 0.3nH 100MHz 10Q-Factor Ceramic 600mA 150mOhm DCR 0603 T/R

Chip1Stop:
Ind High Frequency Chip Unshielded Multi-Layer 4.7nH 0.3nH 100MHz 10Q-Factor Ceramic 600mA 0603

Verical:
Ind High Frequency Chip Unshielded Multi-Layer 4.7nH 0.3nH 100MHz 10Q-Factor Ceramic 600mA 0603

Newark:
# TDK  MLG1608B4N7S  Surface Mount High Frequency Inductor, MLG Series, 4.7 nH, 600 mA, 0603 [1608 Metric], Multilayer

MASTER:
Inductor High Frequency Chip Unshielded Multi-Layer 4.7nH 0.3nH 100MHz 10Q-Factor Ceramic 600mA 150mOhm DCR 0603 T/R

Electro Sonic:
Inductor High Frequency Chip Unshielded Multi-Layer 4.7nH 0.3nH 100MHz 10Q-Factor Ceramic 600mA 150mOhm DCR 0603 T/R