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MPC5517GAVMG80

MPC5517GAVMG80

数据手册.pdf
NXP(恩智浦) 主动器件

NXP  MPC5517GAVMG80  芯片, 32位微控制器, QORIVVA系列, 208MAPBGA

Overview

Designed for body electronics, the ® MPC5510 MCU belongs to an expanding family of automotive-focused products that address the next wave of central body and gateway applications within the vehicle.

* Offers high-performance while continuing to meet low-power requirements

* Enables centralized architectures, which reduce the number of distributed ECUs and complexity of vehicle architectures

* Provides extensive communication capabilities e.g., FlexRay, multiple CAN and LIN support

* Offers room to grow with scalable family ranging from 512 KB up to 1.5 MB of embedded flash

* Backed by a third-party ecosystem of development tools and software

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## Features

* Power Architecture e200z1 core with variable length encoding VLE

* Optional VLE-only 32/16-bit e200z0 secondary core

* 16-channel eDMA enhanced direct memory access

* Memory management unit MMU with 4-entry translation look-aside buffer TLB

* Multiple low-power modes

* JTAG and Nexus class 2+ debug support

* Up to 1.5 MB of flash with error correction coding ECC

* The flash module features read while write RWW and small partitions for optimal bootloader and EEPROM emulation support

* Up to 80 KB of SRAM with ECC

* Memory protection unit MPU with up to 16 regions and 32B granularity

* This product is included in NXP®.s product longevity program, with assured supply for a minimum of 15 years after launch

## Features

MPC5517GAVMG80中文资料参数规格
技术参数

无卤素状态 Halogen Free

针脚数 208

时钟频率 80.0 MHz

RAM大小 80 KB

模数转换数ADC 1

输入/输出数 145 Input

工作温度Max 125 ℃

工作温度Min -40 ℃

电源电压Max 5.25 V

电源电压Min 4.5 V

封装参数

安装方式 Surface Mount

引脚数 208

封装 BGA-208

外形尺寸

封装 BGA-208

物理参数

工作温度 -40℃ ~ 125℃

其他

产品生命周期 Active

包装方式 Tray

制造应用 Automotive, 车用

符合标准

RoHS标准 RoHS Compliant

含铅标准 无铅

REACH SVHC标准 No SVHC

REACH SVHC版本 2015/12/17

MPC5517GAVMG80引脚图与封装图
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