A16104-04

LAIRD TECHNOLOGIES  A16104-04  热缝隙填充, 229 X 229MM, 1MM

The is a 1mm Thermal Gap Filler with excellent thermal performance and great handling for mass-production applications. The low modulus interface pad conforms to component topography, resulting in little stress on the components, mating chassis or parts. The softness relieves mechanical stress from high stack-up tolerance and absorbs shock, resulting in improved device reliability. Tflex™ HR600"s recovery properties for applications requiring material rework result in continued mechanical integrity even after device rework and re-assembly. It is naturally tacky on both sides and requires no additional adhesive coating to inhibit thermal performance. The tack is designed to hold the pad in place during assembly and component transport. It is suitable for cooling components to chassis, frame or other mating components, memory modules, home and small office network equipment, mass storage devices, radios, LCD/PDP flat panel TV, set top boxes, IT infrastructure applications

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Mid-performance gap filler

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Electrically insulating

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Soft and compliant

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Naturally tacky for adhesion during assembly and transport

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UL94V-0 Flammability rating

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-45 to 200°C Operating temperature