| | | | | 厂家: - 逻辑类型: CML/LVPECL Backplane Transceiver w/ Integrated Loopback 电源电压: 3V ~ 3.6V 工作温度: -40°C ~ 85°C 封装/外壳: 24-VFQFN Exposed Pad, 24-MLF® |
| | | | | 厂家: - 逻辑类型: Differential Receiver/Driver 电源电压: 3V ~ 3.6V 工作温度: -40°C ~ 85°C 封装/外壳: 16-VFQFN Exposed Pad, 16-MLF® |
| | | | | 厂家: - 逻辑类型: Differential Receiver 电源电压: 3V ~ 3.6V 工作温度: -40°C ~ 85°C 封装/外壳: 8-VFDFN Exposed Pad, 8-MLF® |
| | | | | 厂家: - 逻辑类型: Binary Full Adder with Fast Carry 电源电压: 2V ~ 6V 工作温度: -40°C ~ 125°C 封装/外壳: 16-SOIC (0.154", 3.90mm Width) |
| | | | | 厂家: - 逻辑类型: Cherry Trail Essentials 电源电压: 3V ~ 4.5V 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 20-UFQFN |
| | | | | 厂家: - 逻辑类型: Cherry Trail Essentials 电源电压: 3V ~ 4.5V 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 20-UFQFN |
| | | | | 厂家: - 逻辑类型: 1:1, 1:2 Configurable Registered Buffer with Parity 电源电压: 1.7V ~ 1.9V 工作温度: 0°C ~ 70°C 封装/外壳: 96-LFBGA |
| | | | | 厂家: - 逻辑类型: 1:2 Registered Buffer with Parity 电源电压: 1.7V ~ 1.9V 工作温度: 0°C ~ 70°C 封装/外壳: 160-TFBGA |
| | | | | 厂家: - 逻辑类型: 1:2 Registered Buffer with Parity 电源电压: 1.7V ~ 1.9V 工作温度: 0°C ~ 70°C 封装/外壳: 160-TFBGA |
| | | | | 厂家: - 逻辑类型: 1:2 Registered Buffer with Parity 电源电压: 1.7V ~ 1.9V 工作温度: 0°C ~ 70°C 封装/外壳: 160-TFBGA |
| | | | | 厂家: - 逻辑类型: 1:1, 1:2 Configurable Registered Buffer 电源电压: 1.7V ~ 2V 工作温度: 0°C ~ 70°C 封装/外壳: 96-LFBGA |
| | | | | 厂家: - 逻辑类型: 1:1, 1:2 Configurable Registered Buffer 电源电压: 1.7V ~ 2V 工作温度: 0°C ~ 70°C 封装/外壳: 96-LFBGA |
| | | | | 厂家: - 逻辑类型: 1:1, 1:2 Configurable Registered Buffer 电源电压: 1.7V ~ 2V 工作温度: 0°C ~ 70°C 封装/外壳: 96-LFBGA |
| | | | | 厂家: - 逻辑类型: 1:1, 1:2 Configurable Registered Buffer 电源电压: 1.7V ~ 2V 工作温度: 0°C ~ 70°C 封装/外壳: 96-LFBGA |
| | | | | 厂家: - 逻辑类型: Buffer/Driver with Parity 电源电压: 4.5V ~ 5.5V 工作温度: 0°C ~ 70°C 封装/外壳: 24-SOIC (0.295", 7.50mm Width) |
| | | | | 厂家: - 逻辑类型: Differential Receiver 电源电压: 4.2V ~ 5.5V 工作温度: -40°C ~ 85°C 封装/外壳: 28-LCC (J-Lead) |
| | | | | 厂家: - 逻辑类型: Differential Receiver 电源电压: 4.75V ~ 5.25V 工作温度: 0°C ~ 85°C 封装/外壳: 16-SOIC (0.154", 3.90mm Width) |
| | | | | 厂家: - 逻辑类型: Differential Receiver/Driver 电源电压: 2.375V ~ 3.6V 工作温度: -40°C ~ 85°C 封装/外壳: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
| | | | | 厂家: - 逻辑类型: Differential Receiver 电源电压: 3.3V, 5V 工作温度: -40°C ~ 85°C 封装/外壳: 8-SOIC (0.154", 3.90mm Width) |
| | | | | 厂家: - 逻辑类型: Differential Receiver/Driver 电源电压: 2.375V ~ 2.625V 工作温度: -40°C ~ 85°C 封装/外壳: 8-VFDFN Exposed Pad, 8-MLF® |
| | | | | 厂家: - 逻辑类型: Differential Receiver/Driver 电源电压: 2.375V ~ 2.625V 工作温度: -40°C ~ 85°C 封装/外壳: 8-VFDFN Exposed Pad, 8-MLF® |
| | | | | 厂家: - 逻辑类型: Differential Receiver 电源电压: 3.3V, 5V 工作温度: -40°C ~ 85°C 封装/外壳: 8-SOIC (0.154", 3.90mm Width) |
| | | | | 厂家: - 逻辑类型: Comparator, Driver 电源电压: -1.5V ~ 6.5V 工作温度: 0°C ~ 70°C 封装/外壳: 100-TQFP Exposed Pad |
| | | | | 厂家: - 逻辑类型: Comparator, Driver 电源电压: -1.5V ~ 6.5V 工作温度: 0°C ~ 70°C 封装/外壳: 100-TQFP Exposed Pad |
| | | | | 厂家: - 逻辑类型: Registered Buffer with SSTL_2 Compatible I/O for DDR 电源电压: 2.3V ~ 2.7V 工作温度: 0°C ~ 70°C 封装/外壳: 56-VFQFN Exposed Pad |
| | | | | 厂家: - 逻辑类型: 1:2 Configurable Registered Buffer with Parity 电源电压: 1.7V ~ 1.9V 工作温度: 0°C ~ 70°C 封装/外壳: 176-TFBGA |
| | | | | 厂家: - 逻辑类型: Registered Buffer with SSTL_2 Compatible I/O for DDR 电源电压: 2.3V ~ 2.7V 工作温度: 0°C ~ 70°C 封装/外壳: 48-TFSOP (0.240", 6.10mm Width) |
| | | | | 厂家: - 逻辑类型: 1:2 Configurable Registered Buffer with Parity 电源电压: 1.7V ~ 2V 工作温度: 0°C ~ 70°C 封装/外壳: 176-TFBGA |
| | | | | 厂家: - 逻辑类型: Differential Receiver/Driver 电源电压: 3V ~ 5.5V 工作温度: -40°C ~ 85°C 封装/外壳: 8-SOIC (0.154", 3.90mm Width) |
| | | | | 厂家: - 逻辑类型: Differential Receiver 电源电压: 3.3V, 5V 工作温度: -40°C ~ 85°C 封装/外壳: 8-SOIC (0.154", 3.90mm Width) |
| | | | | 厂家: - 逻辑类型: 1:2 Configurable Registered Buffer with Parity 电源电压: 1.7V ~ 1.9V 工作温度: 0°C ~ 70°C 封装/外壳: 176-TFBGA |
| | | | | 厂家: - 逻辑类型: Registered Buffer with SSTL_2 Compatible I/O for DDR 电源电压: 2.3V ~ 2.7V 工作温度: 0°C ~ 70°C 封装/外壳: 56-VFQFN Exposed Pad |
| | | | | 厂家: - 逻辑类型: Registered Buffer with SSTL_2 Compatible I/O for DDR 电源电压: 2.3V ~ 2.7V 工作温度: 0°C ~ 70°C 封装/外壳: 48-TFSOP (0.173", 4.40mm Width) |
| | | | | 厂家: - 逻辑类型: Registered Buffer with SSTL_2 Compatible I/O for DDR 电源电压: 2.3V ~ 2.7V 工作温度: 0°C ~ 70°C 封装/外壳: 48-TFSOP (0.173", 4.40mm Width) |
| | | | | 厂家: - 逻辑类型: Registered Buffer for DDR2 电源电压: 1.7V ~ 1.9V 工作温度: - 封装/外壳: 176-TFBGA |
| | | | | 厂家: - 逻辑类型: Registered Buffer for DDR2 电源电压: 1.7V ~ 1.9V 工作温度: - 封装/外壳: 176-TFBGA |
| | | | | 厂家: - 逻辑类型: Registered Buffer for DDR2 电源电压: 1.7V ~ 1.9V 工作温度: 0°C ~ 70°C 封装/外壳: 96-LFBGA |
| | | | | 厂家: - 逻辑类型: 1:2 Configurable Registered Buffer 电源电压: 1.7V ~ 1.9V 工作温度: 0°C ~ 70°C 封装/外壳: 150-TFBGA |
| | | | | 厂家: - 逻辑类型: 1:2 Registered Buffer with Parity 电源电压: 1.7V ~ 1.9V 工作温度: 0°C ~ 70°C 封装/外壳: 160-LFBGA |
| | | | | 厂家: - 逻辑类型: Translating Transceiver 电源电压: 1.65V ~ 5.5V 工作温度: -40°C ~ 125°C (TA) 封装/外壳: 14-VFQFN Exposed Pad |
| | | | | 厂家: - 逻辑类型: Translating Transceiver 电源电压: 1.65V ~ 5.5V 工作温度: -40°C ~ 125°C 封装/外壳: 14-VFQFN Exposed Pad |
| | | | | 厂家: - 逻辑类型: Differential Receiver/Driver 电源电压: 2.375V ~ 2.625V 工作温度: -40°C ~ 85°C 封装/外壳: 8-VFDFN Exposed Pad, 8-MLF® |
| | | | | 厂家: - 逻辑类型: Differential Receiver/Driver 电源电压: 2.375V ~ 2.625V 工作温度: -40°C ~ 85°C 封装/外壳: 8-VFDFN Exposed Pad, 8-MLF® |
| | | | | 厂家: - 逻辑类型: Differential Receiver 电源电压: 3.3V, 5V 工作温度: -40°C ~ 85°C 封装/外壳: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
| | | | | 厂家: - 逻辑类型: Differential Receiver 电源电压: 3.3V, 5V 工作温度: -40°C ~ 85°C 封装/外壳: 8-SOIC (0.154", 3.90mm Width) |
| | | | | 厂家: - 逻辑类型: Differential Receiver 电源电压: 4.2V ~ 5.5V 工作温度: 0°C ~ 85°C 封装/外壳: 28-LCC (J-Lead) |
| | | | | 厂家: - 逻辑类型: Differential Receiver 电源电压: 4.75V ~ 5.25V 工作温度: 0°C ~ 85°C 封装/外壳: 16-SOIC (0.154", 3.90mm Width) |
| | | | | 厂家: - 逻辑类型: Differential Receiver/Driver 电源电压: 3V ~ 5.5V 工作温度: -40°C ~ 85°C 封装/外壳: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Exposed Pad |
| | | | | 厂家: - 逻辑类型: Differential Receiver 电源电压: 3.3V, 5V 工作温度: -40°C ~ 85°C 封装/外壳: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
| | | | | 厂家: - 逻辑类型: Differential Receiver 电源电压: 3.3V, 5V 工作温度: -40°C ~ 85°C 封装/外壳: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |