| | | | | 厂家: - 系列: - 零件状态: Discontinued at Digi-Key 工作温度: -40°C ~ 125°C 封装/外壳: 8-WFDFN Exposed Pad, CSP |
| | | | | 厂家: - 系列: - 零件状态: Discontinued at Digi-Key 工作温度: -40°C ~ 125°C 封装/外壳: 8-WFDFN Exposed Pad, CSP |
| | | | | 厂家: - 系列: - 零件状态: Obsolete 工作温度: -40°C ~ 85°C 封装/外壳: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) |
| | | | | 厂家: - 系列: DigiTrim® 零件状态: Discontinued at Digi-Key 工作温度: -40°C ~ 85°C 封装/外壳: 8-VFDFN Exposed Pad, CSP |
| | | | | 厂家: - 系列: - 零件状态: Discontinued at Digi-Key 工作温度: -40°C ~ 125°C 封装/外壳: 8-WFDFN Exposed Pad, CSP |
| | | | | 厂家: - 系列: - 零件状态: Discontinued at Digi-Key 工作温度: -40°C ~ 125°C 封装/外壳: 8-WFDFN Exposed Pad, CSP |
| | | | | 厂家: - 系列: - 零件状态: Discontinued at Digi-Key 工作温度: -40°C ~ 125°C 封装/外壳: 8-WFDFN Exposed Pad, CSP |
| | | | | 厂家: - 系列: - 零件状态: Discontinued at Digi-Key 工作温度: -40°C ~ 85°C 封装/外壳: 16-TSSOP (0.173", 4.40mm Width) |
| | | | | 厂家: - 系列: - 零件状态: Obsolete 工作温度: -40°C ~ 85°C 封装/外壳: 16-DIP (0.300", 7.62mm) |
| | | | | 厂家: - 系列: - 零件状态: Discontinued at Digi-Key 工作温度: -40°C ~ 85°C 封装/外壳: 16-TSSOP (0.173", 4.40mm Width) |
| | | | | 厂家: - 系列: - 零件状态: Discontinued at Digi-Key 工作温度: -40°C ~ 125°C 封装/外壳: 16-WFQFN Exposed Pad, CSP |
| | | | | 厂家: - 系列: - 零件状态: Obsolete 工作温度: -55°C ~ 125°C 封装/外壳: Die |
| | | | | 厂家: - 系列: - 零件状态: Obsolete 工作温度: 0°C ~ 70°C 封装/外壳: Die |
| | | | | 厂家: - 系列: - 零件状态: Obsolete 工作温度: -40°C ~ 105°C 封装/外壳: 8-SOIC (0.154", 3.90mm Width) Exposed Pad |
| | | | | 厂家: - 系列: - 零件状态: Obsolete 工作温度: -40°C ~ 85°C 封装/外壳: 24-WFQFN Exposed Pad, CSP |
| | | | | 厂家: - 系列: - 零件状态: Obsolete 工作温度: -40°C ~ 125°C 封装/外壳: 8-WFDFN Exposed Pad, CSP |
| | | | | 厂家: - 系列: - 零件状态: Obsolete 工作温度: -40°C ~ 125°C 封装/外壳: 16-WFQFN Exposed Pad, CSP |
| | | | | 厂家: - 系列: - 零件状态: Obsolete 工作温度: -40°C ~ 125°C 封装/外壳: 8-UFDFN, CSP |
| | | | | 厂家: - 系列: - 零件状态: Obsolete 工作温度: -40°C ~ 125°C 封装/外壳: 10-UFQFN, CSP |
| | | | | 厂家: - 系列: - 零件状态: Obsolete 工作温度: -40°C ~ 125°C 封装/外壳: 9-UFBGA, WLCSP |
| | | | | 厂家: - 系列: - 零件状态: Discontinued at Digi-Key 工作温度: -40°C ~ 125°C 封装/外壳: 8-WFDFN Exposed Pad, CSP |
| | | | | 厂家: - 系列: - 零件状态: Discontinued at Digi-Key 工作温度: -40°C ~ 125°C 封装/外壳: 8-WFDFN Exposed Pad, CSP |
| | | | | 厂家: - 系列: - 零件状态: Discontinued at Digi-Key 工作温度: -40°C ~ 125°C 封装/外壳: 8-WFDFN Exposed Pad, CSP |
| | | | | 厂家: - 系列: - 零件状态: Discontinued at Digi-Key 工作温度: -40°C ~ 125°C 封装/外壳: 8-WFDFN Exposed Pad, CSP |
| | | | | 厂家: - 系列: - 零件状态: Discontinued at Digi-Key 工作温度: -40°C ~ 125°C 封装/外壳: 16-VQFN, CSP |
| | | | | 厂家: - 系列: - 零件状态: Discontinued at Digi-Key 工作温度: -40°C ~ 125°C 封装/外壳: 8-WFDFN Exposed Pad, CSP |
| | | | | 厂家: - 系列: - 零件状态: Discontinued at Digi-Key 工作温度: -40°C ~ 125°C 封装/外壳: 8-WFDFN Exposed Pad, CSP |
| | | | | 厂家: - 系列: - 零件状态: Discontinued at Digi-Key 工作温度: -40°C ~ 125°C 封装/外壳: 16-VQFN, CSP |
| | | | | 厂家: - 系列: - 零件状态: Discontinued at Digi-Key 工作温度: -40°C ~ 125°C 封装/外壳: 8-WFDFN Exposed Pad, CSP |
| | | | | 厂家: - 系列: - 零件状态: Discontinued at Digi-Key 工作温度: -40°C ~ 125°C 封装/外壳: 8-WFDFN Exposed Pad, CSP |
| | | | | 厂家: - 系列: - 零件状态: Discontinued at Digi-Key 工作温度: -40°C ~ 125°C 封装/外壳: 16-WFQFN Exposed Pad, CSP |
| | | | | 厂家: - 系列: - 零件状态: Discontinued at Digi-Key 工作温度: -40°C ~ 125°C 封装/外壳: 16-WFQFN Exposed Pad, CSP |
| | | | | 厂家: - 系列: - 零件状态: Discontinued at Digi-Key 工作温度: -40°C ~ 125°C 封装/外壳: 16-WFQFN Exposed Pad, CSP |
| | | | | 厂家: - 系列: - 零件状态: Obsolete 工作温度: -40°C ~ 125°C 封装/外壳: 8-SOIC (0.154", 3.90mm Width) Exposed Pad |
| | | | | 厂家: - 系列: - 零件状态: Obsolete 工作温度: -40°C ~ 125°C 封装/外壳: - |
| | | | | 厂家: - 系列: - 零件状态: Obsolete 工作温度: -40°C ~ 125°C 封装/外壳: 14-UFBGA, WLCSP |
| | | | | 厂家: - 系列: - 零件状态: Discontinued at Digi-Key 工作温度: -40°C ~ 125°C 封装/外壳: 8-VFDFN Exposed Pad, CSP |
| | | | | 厂家: - 系列: - 零件状态: Discontinued at Digi-Key 工作温度: -40°C ~ 125°C 封装/外壳: 8-VFDFN Exposed Pad, CSP |
| | | | | 厂家: - 系列: - 零件状态: Discontinued at Digi-Key 工作温度: -40°C ~ 125°C 封装/外壳: 8-VFDFN Exposed Pad, CSP |
| | | | | 厂家: - 系列: iPolar® 零件状态: Obsolete 工作温度: -40°C ~ 125°C 封装/外壳: 8-SOIC (0.154", 3.90mm Width) |
| | | | | 厂家: - 系列: - 零件状态: Obsolete 工作温度: -40°C ~ 125°C 封装/外壳: 14-SOIC (0.154", 3.90mm Width) |
| | | | | 厂家: - 系列: - 零件状态: Obsolete 工作温度: -40°C ~ 85°C 封装/外壳: 8-SOIC (0.154", 3.90mm Width) |
| | | | | 厂家: - 系列: - 零件状态: Obsolete 工作温度: -40°C ~ 85°C 封装/外壳: 8-SOIC (0.154", 3.90mm Width) |
| | | | | 厂家: - 系列: - 零件状态: Obsolete 工作温度: -40°C ~ 85°C 封装/外壳: 8-SOIC (0.154", 3.90mm Width) |
| | | | | 厂家: - 系列: - 零件状态: Obsolete 工作温度: -40°C ~ 85°C 封装/外壳: 24-WFQFN Exposed Pad, CSP |
| | | | | 厂家: - 系列: - 零件状态: Discontinued at Digi-Key 工作温度: -40°C ~ 85°C 封装/外壳: 24-WFQFN Exposed Pad, CSP |
| | | | | 厂家: - 系列: - 零件状态: Discontinued at Digi-Key 工作温度: -40°C ~ 85°C 封装/外壳: 24-WFQFN Exposed Pad, CSP |
| | | | | 厂家: - 系列: - 零件状态: Discontinued at Digi-Key 工作温度: -40°C ~ 85°C 封装/外壳: 24-WFQFN Exposed Pad, CSP |
| | | | | 厂家: - 系列: - 零件状态: Obsolete 工作温度: -40°C ~ 125°C 封装/外壳: SC-74A, SOT-753 |
| | | | | 厂家: - 系列: - 零件状态: Obsolete 工作温度: -40°C ~ 125°C 封装/外壳: 8-WFDFN Exposed Pad, CSP |