| | | | | 厂家: - 采样率(每秒): 10k 零件状态: Obsolete 工作温度: -40°C ~ 85°C 封装/外壳: 20-SOIC (0.295", 7.50mm Width) |
| | | | | 厂家: - 采样率(每秒): 10k 零件状态: Obsolete 工作温度: -40°C ~ 85°C 封装/外壳: 20-SOIC (0.295", 7.50mm Width) |
| | | | | 厂家: - 采样率(每秒): 20M 零件状态: Discontinued at Digi-Key 工作温度: -40°C ~ 85°C 封装/外壳: 32-LQFP |
| | | | | 厂家: - 采样率(每秒): 20M 零件状态: Obsolete 工作温度: -40°C ~ 85°C 封装/外壳: 32-LQFP |
| | | | | 厂家: - 采样率(每秒): 25k 零件状态: Obsolete 工作温度: -40°C ~ 85°C 封装/外壳: 28-LCC (J-Lead) |
| | | | | 厂家: - 采样率(每秒): 50M 零件状态: Discontinued at Digi-Key 工作温度: -40°C ~ 85°C 封装/外壳: 48-VFQFN Exposed Pad |
| | | | | 厂家: - 采样率(每秒): 80M 零件状态: Discontinued at Digi-Key 工作温度: -40°C ~ 85°C 封装/外壳: 48-VFQFN Exposed Pad |
| | | | | 厂家: - 采样率(每秒): 210M 零件状态: Discontinued at Digi-Key 工作温度: -40°C ~ 85°C 封装/外壳: 64-VFQFN Exposed Pad |
| | | | | 厂家: - 采样率(每秒): 210M 零件状态: Discontinued at Digi-Key 工作温度: -40°C ~ 85°C 封装/外壳: 64-VFQFN Exposed Pad |
| | | | | 厂家: - 采样率(每秒): 200M 零件状态: Discontinued at Digi-Key 工作温度: -40°C ~ 85°C 封装/外壳: 64-VFQFN Exposed Pad |
| | | | | 厂家: - 采样率(每秒): 250M 零件状态: Discontinued at Digi-Key 工作温度: -40°C ~ 85°C 封装/外壳: 48-VFQFN Exposed Pad |
| | | | | 厂家: - 采样率(每秒): 210M 零件状态: Discontinued at Digi-Key 工作温度: -40°C ~ 85°C 封装/外壳: 48-VFQFN Exposed Pad |
| | | | | 厂家: - 采样率(每秒): 250M 零件状态: Discontinued at Digi-Key 工作温度: -40°C ~ 85°C 封装/外壳: 48-VFQFN Exposed Pad |
| | | | | 厂家: - 采样率(每秒): 210M 零件状态: Discontinued at Digi-Key 工作温度: -40°C ~ 85°C 封装/外壳: 48-VFQFN Exposed Pad |
| | | | | 厂家: - 采样率(每秒): 1M 零件状态: Obsolete 工作温度: -40°C ~ 125°C 封装/外壳: 24-VFQFN Exposed Pad |
| | | | | 厂家: - 采样率(每秒): 1M 零件状态: Obsolete 工作温度: -40°C ~ 125°C 封装/外壳: 24-VFQFN Exposed Pad |
| | | | | 厂家: - 采样率(每秒): 200k 零件状态: Obsolete 工作温度: -40°C ~ 85°C 封装/外壳: 28-TSSOP (0.173", 4.40mm Width) |
| | | | | 厂家: - 采样率(每秒): 1M 零件状态: Obsolete 工作温度: -40°C ~ 85°C 封装/外壳: 64-VFQFN Exposed Pad |
| | | | | 厂家: - 采样率(每秒): 1M 零件状态: Obsolete 工作温度: -40°C ~ 85°C 封装/外壳: 64-VFQFN Exposed Pad |
| | | | | 厂家: - 采样率(每秒): 200k 零件状态: Obsolete 工作温度: -40°C ~ 85°C 封装/外壳: 28-TSSOP (0.173", 4.40mm Width) |
| | | | | 厂家: - 采样率(每秒): 188.9k 零件状态: Obsolete 工作温度: -40°C ~ 105°C 封装/外壳: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
| | | | | 厂家: - 采样率(每秒): 200k 零件状态: Obsolete 工作温度: -40°C ~ 85°C 封装/外壳: 28-SOIC (0.295", 7.50mm Width) |
| | | | | 厂家: - 采样率(每秒): 1M 零件状态: Obsolete 工作温度: -40°C ~ 85°C 封装/外壳: 16-TSSOP (0.173", 4.40mm Width) |
| | | | | 厂家: - 采样率(每秒): 500k 零件状态: Obsolete 工作温度: -40°C ~ 85°C 封装/外壳: 10-VFDFN Exposed Pad |
| | | | | 厂家: - 采样率(每秒): 170M 零件状态: Obsolete 工作温度: -40°C ~ 85°C 封装/外壳: 64-VFQFN Exposed Pad |
| | | | | 厂家: - 采样率(每秒): 1M 零件状态: Obsolete 工作温度: -40°C ~ 85°C 封装/外壳: 64-VFQFN Exposed Pad |
| | | | | 厂家: - 采样率(每秒): 1M 零件状态: Obsolete 工作温度: -40°C ~ 85°C 封装/外壳: 64-VFQFN Exposed Pad |
| | | | | 厂家: - 采样率(每秒): 1M 零件状态: Obsolete 工作温度: -40°C ~ 85°C 封装/外壳: 64-VFQFN Exposed Pad |
| | | | | 厂家: - 采样率(每秒): 1M 零件状态: Obsolete 工作温度: -40°C ~ 85°C 封装/外壳: 64-VFQFN Exposed Pad |
| | | | | 厂家: - 采样率(每秒): 105M 零件状态: Discontinued at Digi-Key 工作温度: -40°C ~ 85°C 封装/外壳: 64-VFQFN Exposed Pad |
| | | | | 厂家: - 采样率(每秒): 105M 零件状态: Discontinued at Digi-Key 工作温度: -40°C ~ 85°C 封装/外壳: 64-VFQFN Exposed Pad |
| | | | | 厂家: - 采样率(每秒): 80M 零件状态: Discontinued at Digi-Key 工作温度: -40°C ~ 85°C 封装/外壳: 64-VFQFN Exposed Pad |
| | | | | 厂家: - 采样率(每秒): - 零件状态: Obsolete 工作温度: 0°C ~ 70°C 封装/外壳: 20-DIP (0.300", 7.62mm) |
| | | | | 厂家: - 采样率(每秒): 25M 零件状态: Obsolete 工作温度: -40°C ~ 85°C 封装/外壳: 56-VFQFN Exposed Pad |
| | | | | 厂家: - 采样率(每秒): 250M 零件状态: Obsolete 工作温度: -40°C ~ 85°C 封装/外壳: 64-VFQFN Exposed Pad |
| | | | | 厂家: - 采样率(每秒): 50M 零件状态: Obsolete 工作温度: -40°C ~ 85°C 封装/外壳: 56-VFQFN Exposed Pad |
| | | | | 厂家: - 采样率(每秒): 2G 零件状态: Obsolete 工作温度: -40°C ~ 85°C 封装/外壳: 292-BGA Exposed Pad |
| | | | | 厂家: - 采样率(每秒): 20M 零件状态: Obsolete 工作温度: -40°C ~ 85°C 封装/外壳: 48-TQFP |
| | | | | 厂家: - 采样率(每秒): 80M 零件状态: Discontinued at Digi-Key 工作温度: -40°C ~ 85°C 封装/外壳: 40-VFQFN Exposed Pad |
| | | | | 厂家: - 采样率(每秒): 80M 零件状态: Obsolete 工作温度: -40°C ~ 85°C 封装/外壳: 28-TSSOP (0.173", 4.40mm Width) |
| | | | | 厂家: - 采样率(每秒): 35M 零件状态: Obsolete 工作温度: -40°C ~ 85°C 封装/外壳: 28-TSSOP (0.173", 4.40mm Width) |
| | | | | 厂家: - 采样率(每秒): 76k 零件状态: Obsolete 工作温度: -40°C ~ 85°C 封装/外壳: 28-DIP (0.600", 15.24mm) |
| | | | | 厂家: - 采样率(每秒): 76k 零件状态: Obsolete 工作温度: 0°C ~ 70°C 封装/外壳: 28-DIP (0.600", 15.24mm) |
| | | | | 厂家: - 采样率(每秒): 25M 零件状态: Obsolete 工作温度: -40°C ~ 85°C 封装/外壳: 56-VFQFN Exposed Pad |
| | | | | 厂家: - 采样率(每秒): 1.25M 零件状态: Obsolete 工作温度: -40°C ~ 85°C 封装/外壳: 48-VFQFN Exposed Pad |
| | | | | 厂家: - 采样率(每秒): 1M 零件状态: Discontinued at Digi-Key 工作温度: -40°C ~ 85°C 封装/外壳: 48-VFQFN Exposed Pad |
| | | | | 厂家: - 采样率(每秒): 1M 零件状态: Discontinued at Digi-Key 工作温度: -40°C ~ 85°C 封装/外壳: 48-VFQFN Exposed Pad |
| | | | | 厂家: - 采样率(每秒): 1M 零件状态: Obsolete 工作温度: -40°C ~ 85°C 封装/外壳: 48-VFQFN Exposed Pad |
| | | | | 厂家: - 采样率(每秒): 1M 零件状态: Obsolete 工作温度: -40°C ~ 85°C 封装/外壳: 48-VFQFN Exposed Pad |
| | | | | 厂家: - 采样率(每秒): 1.25M 零件状态: Obsolete 工作温度: -40°C ~ 85°C 封装/外壳: 48-TQFP |