| | | | | 厂家: - 零件状态: Active 应用: Video 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 8-SOIC (0.154", 3.90mm Width) |
| | | | | 厂家: - 零件状态: Active 应用: Networking 工作温度: -40°C ~ 125°C (TA) 封装/外壳: 172-QFN Dual Rows, Exposed Pad |
| | | | | 厂家: - 零件状态: Active 应用: Video 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 48-TFSOP (0.240", 6.10mm Width) |
| | | | | 厂家: - 零件状态: Active 应用: Networking 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 56-WFQFN Exposed Pad |
| | | | | 厂家: - 零件状态: Active 应用: Ultrasound 工作温度: 0°C ~ 70°C (TA) 封装/外壳: 28-LCC (J-Lead) |
| | | | | 厂家: - 零件状态: Active 应用: Video 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 24-TSSOP (0.173", 4.40mm Width) |
| | | | | 厂家: - 零件状态: Obsolete 应用: PCI Express® 工作温度: - 封装/外壳: - |
| | | | | 厂家: - 零件状态: Obsolete 应用: PCI Express® 工作温度: - 封装/外壳: - |
| | | | | 厂家: - 零件状态: Obsolete 应用: PCI Express® 工作温度: - 封装/外壳: - |
| | | | | 厂家: - 零件状态: Active 应用: Ultrasound 工作温度: 0°C ~ 70°C (TA) 封装/外壳: 48-LQFP |
| | | | | 厂家: - 零件状态: Obsolete 应用: Video 工作温度: 0°C ~ 70°C (TA) 封装/外壳: 24-SOIC (0.295", 7.50mm Width) |
| | | | | 厂家: - 零件状态: Obsolete 应用: Video 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 16-SSOP (0.154", 3.90mm Width) |
| | | | | 厂家: - 零件状态: Obsolete 应用: Video 工作温度: 0°C ~ 70°C (TA) 封装/外壳: 16-SOIC (0.154", 3.90mm Width) |
| | | | | 厂家: - 零件状态: Obsolete 应用: Video 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 36-BSOP (0.295", 7.50mm Width) |
| | | | | 厂家: - 零件状态: Obsolete 应用: Video 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 36-BSOP (0.295", 7.50mm Width) |
| | | | | 厂家: - 零件状态: Obsolete 应用: Video 工作温度: 0°C ~ 70°C (TA) 封装/外壳: 16-DIP (0.300", 7.62mm) |
| | | | | 厂家: - 零件状态: Active 应用: - 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 24-TFCQFN Exposed Pad |
| | | | | 厂家: - 零件状态: Active 应用: Telecommunications 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 16-LFCQFN Exposed Pad |
| | | | | 厂家: - 零件状态: Active 应用: Telecommunications 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 32-TFCQFN Exposed Pad |
| | | | | 厂家: - 零件状态: Active 应用: Telecommunications 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 32-TFCQFN Exposed Pad |
| | | | | 厂家: - 零件状态: Active 应用: Telecommunications 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 32-TFCQFN Exposed Pad |
| | | | | 厂家: - 零件状态: Active 应用: Networking 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 32-VFQFN Exposed Pad |
| | | | | 厂家: - 零件状态: Active 应用: Ultrasound 工作温度: 0°C ~ 70°C (TA) 封装/外壳: 48-LQFP |
| | | | | 厂家: - 零件状态: Active 应用: PCI Express® 工作温度: 0°C ~ 85°C (TA) 封装/外壳: 48-LFBGA |
| | | | | 厂家: - 零件状态: Active 应用: Telecommunications 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 40-DIP (0.600", 15.24mm) |
| | | | | 厂家: - 零件状态: Active 应用: Video 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 24-TSSOP (0.173", 4.40mm Width) |
| | | | | 厂家: - 零件状态: Active 应用: Video 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 14-SOIC (0.154", 3.90mm Width) |
| | | | | 厂家: - 零件状态: Active 应用: Telecommunications 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 28-VFQFN Exposed Pad |
| | | | | 厂家: - 零件状态: Active 应用: Video 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 24-TSSOP (0.173", 4.40mm Width) |
| | | | | 厂家: - 零件状态: Active 应用: Video 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 24-TSSOP (0.173", 4.40mm Width) |
| | | | | 厂家: - 零件状态: Active 应用: Video 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 14-SOIC (0.154", 3.90mm Width) |
| | | | | 厂家: - 零件状态: Active 应用: Telecommunications 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 42-VFQFN Exposed Pad |
| | | | | 厂家: - 零件状态: Active 应用: Video 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
| | | | | 厂家: - 零件状态: Active 应用: USB 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 12-UFQFN |
| | | | | 厂家: - 零件状态: Active 应用: Video 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 42-VFQFN Exposed Pad |
| | | | | 厂家: - 零件状态: Active 应用: Video 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 16-SOIC (0.295", 7.50mm Width) |
| | | | | 厂家: - 零件状态: Active 应用: Telecommunications 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 16-SSOP (0.154", 3.90mm Width) |
| | | | | 厂家: - 零件状态: Discontinued at Digi-Key 应用: Audio, Video 工作温度: 0°C ~ 70°C (TA) 封装/外壳: 44-WFQFN Exposed Pad |
| | | | | 厂家: - 零件状态: Discontinued at Digi-Key 应用: Audio, Video 工作温度: 0°C ~ 70°C (TA) 封装/外壳: 44-WFQFN Exposed Pad |
| | | | | 厂家: - 零件状态: Active 应用: Video 工作温度: - 封装/外壳: 42-VFQFN Exposed Pad |
| | | | | 厂家: - 零件状态: Active 应用: Video 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 16-SSOP (0.154", 3.90mm Width) |
| | | | | 厂家: - 零件状态: Active 应用: - 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 16-TSSOP (0.173", 4.40mm Width) |
| | | | | 厂家: - 零件状态: Active 应用: Telecommunications 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 16-SSOP (0.154", 3.90mm Width) |
| | | | | 厂家: - 零件状态: Active 应用: Telecommunications 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 28-VFQFN Exposed Pad |
| | | | | 厂家: - 零件状态: Active 应用: Video 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 16-SSOP (0.154", 3.90mm Width) |
| | | | | 厂家: - 零件状态: Active 应用: Networking 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 16-SSOP (0.154", 3.90mm Width) |
| | | | | 厂家: - 零件状态: Active 应用: Video 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 16-VFQFN Exposed Pad |
| | | | | 厂家: - 零件状态: Active 应用: USB 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 10-VFDFN Exposed Pad |
| | | | | 厂家: - 零件状态: Active 应用: - 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 16-TSSOP (0.173", 4.40mm Width) |
| | | | | 厂家: - 零件状态: Active 应用: Ultrasound 工作温度: 0°C ~ 70°C (TA) 封装/外壳: 28-LCC (J-Lead) |