| | | | | 厂家: - 零件状态: Active 应用: Telecommunications 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 24-TFCQFN Exposed Pad |
| | | | | 厂家: - 零件状态: Active 应用: Telecommunications 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 24-LFQFN Exposed Pad |
| | | | | 厂家: - 零件状态: Active 应用: - 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 24-TFCQFN Exposed Pad |
| | | | | 厂家: - 零件状态: Active 应用: Telecommunications 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 24-TFCQFN Exposed Pad |
| | | | | 厂家: - 零件状态: Active 应用: Telecommunications 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 24-TFCQFN Exposed Pad |
| | | | | 厂家: - 零件状态: Active 应用: Telecommunications 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 16-LFCQFN Exposed Pad |
| | | | | 厂家: - 零件状态: Active 应用: Telecommunications 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 16-LFCQFN Exposed Pad |
| | | | | 厂家: - 零件状态: Active 应用: Telecommunications 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 16-LFCQFN Exposed Pad |
| | | | | 厂家: - 零件状态: Active 应用: Telecommunications 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 16-LFCQFN Exposed Pad |
| | | | | 厂家: - 零件状态: Active 应用: Video 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 176-LQFP |
| | | | | 厂家: - 零件状态: Active 应用: Video 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 176-LQFP |
| | | | | 厂家: - 零件状态: Active 应用: Video 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 32-WFQFN Exposed Pad |
| | | | | 厂家: - 零件状态: Active 应用: Video 工作温度: -40°C ~ 85°C (TA) 封装/外壳: SOT-23-6 |
| | | | | 厂家: - 零件状态: Active 应用: PCI Express® 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 42-VFQFN Exposed Pad |
| | | | | 厂家: - 零件状态: Active 应用: PCIe 4.0, USB 工作温度: -40°C ~ 85°C 封装/外壳: 42-VFQFN Exposed Pad |
| | | | | 厂家: - 零件状态: Active 应用: Networking 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 48-TFSOP (0.173", 4.40mm Width) |
| | | | | 厂家: - 零件状态: Active 应用: Video 工作温度: -40°C ~ 85°C (TA) 封装/外壳: SOT-23-6 |
| | | | | 厂家: - 零件状态: Active 应用: Video 工作温度: -40°C ~ 85°C (TA) 封装/外壳: SOT-23-6 |
| | | | | 厂家: - 零件状态: Active 应用: Video 工作温度: -40°C ~ 85°C (TA) 封装/外壳: SOT-23-6 |
| | | | | 厂家: - 零件状态: Active 应用: USB 工作温度: -40°C ~ 85°C 封装/外壳: 42-VFQFN Exposed Pad |
| | | | | 厂家: - 零件状态: Active 应用: Video 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 24-TSSOP (0.173", 4.40mm Width) |
| | | | | 厂家: - 零件状态: Active 应用: USB 工作温度: -40°C ~ 85°C 封装/外壳: 24-XFQFN Exposed Pad |
| | | | | 厂家: - 零件状态: Active 应用: Video 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 8-SOIC (0.154", 3.90mm Width) |
| | | | | 厂家: - 零件状态: Active 应用: USB 工作温度: -40°C ~ 85°C 封装/外壳: 24-XFQFN Exposed Pad |
| | | | | 厂家: - 零件状态: Active 应用: Video 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 24-TSSOP (0.173", 4.40mm Width) |
| | | | | 厂家: - 零件状态: Active 应用: Video 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 24-TSSOP (0.173", 4.40mm Width) |
| | | | | 厂家: - 零件状态: Active 应用: PCI Express® 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 42-VFQFN Exposed Pad |
| | | | | 厂家: - 零件状态: Active 应用: PCI Express® 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 42-VFQFN Exposed Pad |
| | | | | 厂家: - 零件状态: Active 应用: Video 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 48-TFBGA |
| | | | | 厂家: - 零件状态: Active 应用: PCIe 4.0, USB 工作温度: -40°C ~ 85°C 封装/外壳: 42-VFQFN Exposed Pad |
| | | | | 厂家: - 零件状态: Active 应用: USB 工作温度: - 封装/外壳: 28-VFQFN Exposed Pad |
| | | | | 厂家: - 零件状态: Active 应用: DisplayPort 工作温度: -40°C ~ 105°C 封装/外壳: 42-VFQFN Exposed Pad |
| | | | | 厂家: - 零件状态: Active 应用: Video 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 48-TFBGA |
| | | | | 厂家: - 零件状态: Active 应用: Memory 工作温度: - 封装/外壳: 48-TFBGA |
| | | | | 厂家: - 零件状态: Active 应用: Video 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 42-VFQFN Exposed Pad |
| | | | | 厂家: - 零件状态: Active 应用: Telecommunications 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 16-SOIC (0.154", 3.90mm Width) |
| | | | | 厂家: - 零件状态: Active 应用: USB 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 16-TSSOP (0.173", 4.40mm Width) |
| | | | | 厂家: - 零件状态: Active 应用: Memory 工作温度: - 封装/外壳: 48-TFBGA |
| | | | | 厂家: - 零件状态: Active 应用: VGA Connector 工作温度: - 封装/外壳: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
| | | | | 厂家: - 零件状态: Active 应用: Telecommunications 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 42-WFQFN Exposed Pad |
| | | | | 厂家: - 零件状态: Active 应用: PCI Express® 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 28-VFQFN Exposed Pad |
| | | | | 厂家: - 零件状态: Active 应用: - 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 16-SSOP (0.154", 3.90mm Width) |
| | | | | 厂家: - 零件状态: Active 应用: - 工作温度: 0°C ~ 70°C (TA) 封装/外壳: 16-SSOP (0.154", 3.90mm Width) |
| | | | | 厂家: - 零件状态: Active 应用: Telecommunications 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 16-SOIC (0.154", 3.90mm Width) |
| | | | | 厂家: - 零件状态: Active 应用: Video 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 16-SSOP (0.154", 3.90mm Width) |
| | | | | 厂家: - 零件状态: Active 应用: USB 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 24-XFQFN Exposed Pad |
| | | | | 厂家: - 零件状态: Active 应用: Controller 工作温度: -40°C ~ 85°C 封装/外壳: 12-UFQFN |
| | | | | 厂家: - 零件状态: Active 应用: USB 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 24-XFQFN Exposed Pad |
| | | | | 厂家: - 零件状态: Active 应用: VGA Connector 工作温度: - 封装/外壳: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
| | | | | 厂家: - 零件状态: Active 应用: Video 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 16-SOIC (0.295", 7.50mm Width) |