| | | | | 厂家: - 零件状态: Obsolete 应用: Telecommunications, Ultrasound 工作温度: -40°C ~ 125°C (TA) 封装/外壳: 32-VFQFN Exposed Pad, CSP |
| | | | | 厂家: - 零件状态: Obsolete 应用: Telecommunications, Ultrasound 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 32-VFQFN Exposed Pad, CSP |
| | | | | 厂家: - 零件状态: Obsolete 应用: Telecommunications, Ultrasound 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 32-VFQFN Exposed Pad, CSP |
| | | | | 厂家: - 零件状态: Obsolete 应用: - 工作温度: - 封装/外壳: - |
| | | | | 厂家: - 零件状态: Obsolete 应用: Telecommunications, Ultrasound 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 32-VFQFN Exposed Pad, CSP |
| | | | | 厂家: - 零件状态: Obsolete 应用: - 工作温度: - 封装/外壳: - |
| | | | | 厂家: - 零件状态: Obsolete 应用: - 工作温度: - 封装/外壳: - |
| | | | | 厂家: - 零件状态: Obsolete 应用: - 工作温度: - 封装/外壳: - |
| | | | | 厂家: - 零件状态: Obsolete 应用: - 工作温度: - 封装/外壳: - |
| | | | | 厂家: - 零件状态: Obsolete 应用: Video 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 32-VFQFN Exposed Pad, CSP |
| | | | | 厂家: - 零件状态: Obsolete 应用: Video 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 32-VFQFN Exposed Pad, CSP |
| | | | | 厂家: - 零件状态: Obsolete 应用: Video 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 32-VFQFN Exposed Pad, CSP |
| | | | | 厂家: - 零件状态: Obsolete 应用: Video 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 304-BGA Exposed Pad |
| | | | | 厂家: - 零件状态: Obsolete 应用: Video 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 304-BGA Exposed Pad |
| | | | | 厂家: - 零件状态: Obsolete 应用: Video 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 16-SOIC (0.154", 3.90mm Width) |
| | | | | 厂家: - 零件状态: Obsolete 应用: Video 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 304-BGA Exposed Pad |
| | | | | 厂家: - 零件状态: Obsolete 应用: Video 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 64-TQFP Exposed Pad |
| | | | | 厂家: - 零件状态: Obsolete 应用: Video 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 24-VFQFN Exposed Pad, CSP |
| | | | | 厂家: - 零件状态: Obsolete 应用: Video 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 24-VFQFN Exposed Pad, CSP |
| | | | | 厂家: - 零件状态: Obsolete 应用: Video 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 24-VFQFN Exposed Pad, CSP |
| | | | | 厂家: - 零件状态: Obsolete 应用: Telecommunications 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 48-TFSOP (0.173", 4.40mm Width) |
| | | | | 厂家: - 零件状态: Obsolete 应用: Telecommunications, Ultrasound 工作温度: -40°C ~ 125°C (TA) 封装/外壳: 32-VFQFN Exposed Pad, CSP |
| | | | | 厂家: - 零件状态: Obsolete 应用: Telecommunications, Ultrasound 工作温度: -40°C ~ 125°C (TA) 封装/外壳: 32-VFQFN Exposed Pad, CSP |
| | | | | 厂家: - 零件状态: Obsolete 应用: Telecommunications, Ultrasound 工作温度: -40°C ~ 125°C (TA) 封装/外壳: 32-VFQFN Exposed Pad, CSP |
| | | | | 厂家: - 零件状态: Obsolete 应用: Telecommunications, Ultrasound 工作温度: -40°C ~ 125°C (TA) 封装/外壳: 32-VFQFN Exposed Pad, CSP |
| | | | | 厂家: - 零件状态: Obsolete 应用: Telecommunications, Ultrasound 工作温度: -40°C ~ 125°C (TA) 封装/外壳: 32-VFQFN Exposed Pad, CSP |
| | | | | 厂家: - 零件状态: Obsolete 应用: Telecommunications, Ultrasound 工作温度: -40°C ~ 125°C (TA) 封装/外壳: 32-VFQFN Exposed Pad, CSP |
| | | | | 厂家: - 零件状态: Obsolete 应用: Telecommunications, Ultrasound 工作温度: -40°C ~ 125°C (TA) 封装/外壳: 32-VFQFN Exposed Pad, CSP |
| | | | | 厂家: - 零件状态: Obsolete 应用: Video 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 14-DIP (0.300", 7.62mm) |
| | | | | 厂家: - 零件状态: Obsolete 应用: Video 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 16-SOIC (0.154", 3.90mm Width) |
| | | | | 厂家: - 零件状态: Obsolete 应用: Video 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 16-SOIC (0.154", 3.90mm Width) |
| | | | | 厂家: - 零件状态: Obsolete 应用: Video 工作温度: - 封装/外壳: 50-TFBGA |
| | | | | 厂家: - 零件状态: Obsolete 应用: Telecommunications, Ultrasound 工作温度: -40°C ~ 125°C (TA) 封装/外壳: 32-VFQFN Exposed Pad, CSP |
| | | | | 厂家: - 零件状态: Obsolete 应用: Telecommunications, Ultrasound 工作温度: -40°C ~ 125°C (TA) 封装/外壳: 32-VFQFN Exposed Pad, CSP |
| | | | | 厂家: - 零件状态: Obsolete 应用: Telecommunications, Ultrasound 工作温度: -40°C ~ 125°C (TA) 封装/外壳: 32-VFQFN Exposed Pad, CSP |
| | | | | 厂家: - 零件状态: Discontinued at Digi-Key 应用: Telecommunications, Ultrasound 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 32-VFQFN Exposed Pad, CSP |
| | | | | 厂家: - 零件状态: Obsolete 应用: USB 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 10-WFQFN |
| | | | | 厂家: - 零件状态: Obsolete 应用: Audio, Telecommunications, USB, Video 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 30-UFBGA, WLCSP |
| | | | | 厂家: - 零件状态: Obsolete 应用: Audio, Telecommunications, USB, Video 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 30-UFBGA, WLCSP |
| | | | | 厂家: - 零件状态: Obsolete 应用: Telecommunications, Ultrasound 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 32-VFQFN Exposed Pad, CSP |
| | | | | 厂家: - 零件状态: Obsolete 应用: Telecommunications, Ultrasound 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 32-VFQFN Exposed Pad, CSP |
| | | | | 厂家: - 零件状态: Obsolete 应用: Telecommunications, Ultrasound 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 32-VFQFN Exposed Pad, CSP |
| | | | | 厂家: - 零件状态: Discontinued at Digi-Key 应用: Audio, UART, USB 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 20-XFBGA, DSBGA |
| | | | | 厂家: - 零件状态: Discontinued at Digi-Key 应用: Audio, UART, USB 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 20-XFBGA, DSBGA |
| | | | | 厂家: - 零件状态: Discontinued at Digi-Key 应用: USB 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 8-UFLGA |
| | | | | 厂家: - 零件状态: Discontinued at Digi-Key 应用: USB 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 8-UFLGA |
| | | | | 厂家: - 零件状态: Discontinued at Digi-Key 应用: USB 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 20-WFQFN Exposed Pad |
| | | | | 厂家: - 零件状态: Obsolete 应用: Networking 工作温度: 0°C ~ 70°C (TA) 封装/外壳: 20-TSSOP (0.173", 4.40mm Width) |
| | | | | 厂家: - 零件状态: Obsolete 应用: Networking 工作温度: 0°C ~ 70°C (TA) 封装/外壳: 16-SOIC (0.154", 3.90mm Width) |
| | | | | 厂家: - 零件状态: Obsolete 应用: Video 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 32-VFQFN Exposed Pad, CSP |