| | KIT IMX6U A9 DUALLITE 1GB 未分类 | | | 暂无参数 |
| | Development Boards & Kits - ARM Wandboard Solo (I.MX6) 嵌入式开发套件 | | | 暂无参数 |
| | Development Boards & Kits - ARM PICO-PI-IMX7-STARTKIT 嵌入式开发套件 | | | 暂无参数 |
| | Development Boards & Kits - ARM 嵌入式开发套件 | | | 暂无参数 |
| | System-On-Modules - SOM PICO-IMX7-AT 射频收发器模块 | | | 暂无参数 |
| | Heat Sinks EDM COMPACT 12 MM PASSIVE HEATSINK + 20*20 MM THERMOPAD WITH 0.75 MM THICKNESS FOR NXP I.MX6 DUAL / QUAD / QUADPLUS LIDDED OR I.MX8M + MYLAR 散热片 | | | 暂无参数 |
| | Heat Sinks PICO HEATSINK + THERMOPAD WITH 1.50 MM THICKNESS FOR NXP I.MX6 UL/ULL OR I.MX6 QUAD UNLIDDED or I.MX7 散热片 | | | 暂无参数 |
| | Heat Sinks PICO HEATSINK + THERMOPAD WITH 1.25 MM THICKNESS FOR NXP I.MX6 SOLO OR DUALLITE 散热片 | | | 暂无参数 |
| | Heat Sinks EDM COMPACT 12 MM PASSIVE HEATSINK + 20*20 MM THERMOPAD WITH 1.50 MM THICKNESS FOR NXP I.MX6UL / ULL OR I.MX6 DUAL / QUAD / QUADPLUS UNLIDDED OR I.MX7 + MYLAR 散热片 | | | 暂无参数 |
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| | MOD MULTIMEDIA PROC I.MX6 10PK 嵌入式计算机 | | | 暂无参数 |
| | MOD MULTIMEDIA PROC I.MX6 10PK 嵌入式计算机 | | | 暂无参数 |
| | BOARD DEV I.MX6 QUAD CORE 嵌入式计算机 | | | 暂无参数 |
| | SBC CORTEX-A9 I.MX6 DUAL 1GB 嵌入式计算机 | | | 暂无参数 |
| | SBC CORTEX-A9 I.MX6 SOLO 512MB 嵌入式计算机 | | | 暂无参数 |
| | STARTER KIT FOR PICO-PI-IMX6UL 嵌入式计算机 | | | 暂无参数 |
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| | STARTER KIT FOR ANDROID 嵌入式计算机 | | | 暂无参数 |
| | MOD MULTIMEDIA PROC I.MX6 10PK 嵌入式计算机 | | | 暂无参数 |
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| | KIT EDM CONN/STANDOFF/SCREWS 配件 | | | 暂无参数 |